MediaTek Unveils AI Strategy at Computex 2025
MediaTek made a significant impact at Computex 2025 by unveiling a series of innovative artificial intelligence (AI) solutions aimed at enhancing various devices and platforms. The Taiwan-based chipmaker introduced its first hybrid computing solution designed for edge AI capabilities, a new chipset for in-car infotainment systems, and an Internet-of-Things (IoT) platform that powers a diverse array of devices. These advancements are part of MediaTek’s broader vision to integrate AI across on-device, edge, and cloud environments.
Hybrid Computing Solution
One of the standout innovations presented by MediaTek is a conceptual hybrid computing solution that combines 5G connectivity with on-device AI capabilities. This prototype integrates MediaTek’s AI-powered Fixed Wireless Access (FWA) gateway, promising high performance with substantial bandwidth while maintaining low latency and ensuring data privacy. The company has successfully completed proof-of-concept trials with a leading telecommunications infrastructure provider, showcasing the potential of this technology.
MediaTek’s hybrid solution also features an AI Hub that connects to smart home devices, allowing on-device AI agents to function as personal assistants. Once fully developed, this technology will enable users to control multiple home appliances simultaneously through a centralized AI hub, enhancing convenience and efficiency in smart home management.
Partnership with Nvidia
In a notable collaboration, MediaTek has partnered with Nvidia to create the GB10 Grace Blackwell Superchip, touted as the world’s smallest AI supercomputer for the DGX Spark. This superchip is capable of delivering an impressive performance of 1,000 trillion operations per second (TOPS) and can run AI models with up to 200 billion parameters locally. MediaTek’s involvement in this project includes developing custom application-specific integrated circuit (ASIC) solutions to meet the high-performance and networking demands of modern data centers and AI accelerators.
The company’s roadmap for this initiative includes support for advanced process nodes, high-speed interconnects, and custom high-bandwidth memory (HBM) packaging. These enhancements aim to improve compute density and efficiency, positioning MediaTek as a key player in the evolving landscape of AI technology.
In-Car Infotainment Innovations
MediaTek also introduced its flagship Dimensity Auto Cockpit C-X1 chipset, which integrates AI models and acoustic technologies to create personalized virtual assistants for in-car infotainment systems. This advanced platform supports 8K video playback, Dolby Vision HDR, and Dolby Atmos, significantly enhancing the in-car entertainment experience.
Additionally, the company unveiled the Dimensity Auto Connect MT2739, a cutting-edge in-car 5G Dual SIM Dual Active technology featuring three transmit antennas. This system leverages AI to optimize network connectivity and includes intelligent scene recognition capabilities. MediaTek also demonstrated a 5G eCall system designed to automatically alert emergency services in the event of a serious accident, underscoring the company’s commitment to safety and innovation in automotive technology.
Advancements in IoT Solutions
In the realm of IoT, MediaTek showcased its Genio 720 and 520 platforms, which are designed to support a wide variety of devices across home, retail, industrial, and commercial applications. These platforms can be utilized in motorcycle control boards, robotic arms, and service robots, highlighting their versatility and adaptability.
MediaTek is actively collaborating with IoT industry leaders such as Advantech, ADLINK, and VIA to co-develop applications for its IoT platforms. Furthermore, the company presented its AI-powered Filogic Wi-Fi technology, which can detect interference sources, optimize settings, and allocate bandwidth across multiple devices. Looking ahead, MediaTek plans to launch its 5G-Advanced LEO NR non-terrestrial network (NTN) over the Ku-band in Taiwan, further expanding its influence in the telecommunications sector.
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